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www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 1/ 30 20.feb.2015 rev.002 tsz22111 ? 14 ? 001 operational amplifiers input/output full swing high voltage operation cmos op erational amplifiers bd7561g bd7561sg bd7562xxx bd7562sxxx general descriptions bd7561g/bd7562xxx are cmos op erational amplifiers of the high voltage operation input/output full swing. a lso, bd7561sg/bd7562sxxx which expanded the operating temperature range performs a lineup. an operating voltage range is wide with +5v to +14.5v and is the op erational amplifier which is good at a high slew rate, a low input bias current is most suitable for a sensor amplifier and an industrial equipment. features ? wide operating supply voltage ? input and output full swing ? low supply current ? high large signal voltage gain ? wide temperature range applications ? sensor a mp lifier ? industrial equipment ? consumer equipment key specifications ? operating supply voltage range: single supply +5v to +14.5v split supply 2.5v to 7.25v ? operating temperature range: bd7561g/ bd7562 xxx -40c to +85c bd7561sg/ bd7562s xxx -40c to +105c ? sew rate: 0.9v/ s (typ) ? input offset current: 1pa (typ) ? input bias current: 1pa (typ) package w(typ) x d(typ) x h(max) ssop5 2.90mm x 2.80mm x 1.15mm sop8 5.00mm x 6.20mm x 1.61mm msop8 2.90mm x 4.00mm x 0.83mm simplified schematic product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys. figure 1. simplified schematic vdd vss in+ v bias in - out class ab control v bias datashee t downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 2/ 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet pin configuration bd7561 g, bd7561sg: ssop5 pin no. pin name 1 in + 2 vss 3 in - 4 out 5 vdd bd7562f, bd7562 sf : sop8 bd 75 62fvm , bd7562sfvm: msop8 pin n o. pin name 1 out1 2 in1- 3 in1+ 4 vss 5 in2+ 6 in2- 7 out2 8 vdd package ssop5 sop8 msop8 bd7561g bd7561sg bd7562f bd7562sf bd7562fvm bd7562sfvm ordering information b d 7 5 6 x x x x x - x x part number bd7561g bd7561 sg bd7562xxx bd7562sxxx package g : ssop5 f : sop8 fvm : msop8 packaging and forming specification e2: embossed tape and reel (sop8) tr: embossed tape and reel (ssop5/msop8) line - up topr channels supply current package orderable part number -40c to +85c 1ch 370a ssop5 reel of 3000 bd7561g- tr 2ch 75 0a sop8 reel of 2500 bd7562f- e2 msop8 reel of 3000 bd7562fvm- tr -40c to +105c 1ch 370a ssop5 reel of 3000 bd7561 sg - tr 2 ch 75 0a sop8 reel of 2500 bd7562 sf - e2 msop8 reel of 3000 bd7562sfvm- tr + ch 2 - + ch1 - + 1 2 3 4 8 7 6 5 vss out1 in 1- in1+ out2 vdd in2+ in2- 1 - + 2 3 4 5 vss in - in+ vdd out downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 3/ 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet absolute maximum ratings (t a =25c) parameter symbol rating unit bd7561 g bd7562xxx bd7561sg bd7562sxxx supply voltage vdd- vss +15.5 v power dissipation p d ssop5 0.54 (note 1,4) - 0.54 (note 1,4) - w sop8 - 0.55 (note 2,4) - 0.55 (note 2,4) msop8 - 0.47 (note 3,4) - 0.47 (note 3,4) differential input voltage (note 5) v id vdd - vss v input common-mode voltage range v icm (vss - 0.3) to (vdd + 0.3) v input current (note 6) i i 10 ma operating supply voltage v opr single +5 to + 14 .5 v split 2.5 to 7 .25 v operating temperature t opr - 40 to +85 - 40 to +1 05 c storage temperature t stg - 55 to + 125 c maximum junction temperature t jmax + 125 c (note 1) to use at temperature above t a = 25 ? c reduce 5.4 mw /c . (note 2) to use at temperature above t a = 25 ? c reduce 5. 5 mw /c . (note 3) to use at temperature above t a = 25 ? c reduce 4.7 mw /c . (note 4) mounted on a fr4 glass epoxy p cb 70mm70mm1.6mm (copper foil area less than 3%). (note 5) the voltage difference between inverting input and non-inver ting input is the differential input voltage. then input pin voltage is set to more than v ss . (note 6) an excessive input current will flow when input voltages of more than vdd+0.6v or less than vss-0.6v are applied. the input current can be set to less than the rated current by adding a limiting resistor. caution: operating the ic over the absolute maximum ratings may d amage the ic. the damage can either be a short circuit b etween pins or an open circuit between pins and the internal circuitry. therefore, it is imp ortant to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 4/ 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet electrical characteristics bd7561g, bd7561 sg (unless otherwise specified vdd=+ 12 v, vss=0v, t a =25c) parameter symbol temperature r ange limit unit conditions min typ max input offset voltage (note 7,8) v io 25 c - 1 9 mv vdd=5 to 14.5v full range - - 10 input offset c ur rent (note 7) i io 25 c - 1 - pa - input bias current (note 7) i b 25 c - 1 - pa - supply current (note 8) i dd 25 c - 370 550 a r l = , a v =0db, vdd=5v, in+=2.5v full range - - 600 25 c - 440 650 r l = , a v =0db, vdd=12v, in+=6.0v full range - - 700 maximum output voltage (high) v oh 25 c vdd-0.1 - - v r l =10k maximum output voltage ( low ) v ol 25 c - - vss+0.1 v r l =10k large single voltage gain a v 25 c 70 95 - db r l =10k input common-mode voltage range v icm 25 c 0 - 12 v vss to vdd common-mode rejection ratio cmrr 25 c 45 60 - db - power supply rejection ratio psrr 25 c 60 80 - db - output source current (note 9) i source 25 c 3 8 - ma out=vdd-0.4v output sink current (note 9) i sink 25 c 4 14 - ma out=vss+0.4v slew rate sr 25 c - 0.9 - v/s c l =25pf gain bandwidth gbw 25 c - 1.0 - mhz c l =25pf, a v =40db phase margin 25 c - 50 - deg c l =25pf, a v =40db total harmonic distortion + noise thd +n 25 c - 0.05 - % out= 1v p-p ,f=1khz (note 7) absolute value. (note 8) full range:bd7561g:t a =- 40 c to +85c bd7561s:t a =- 40 c to +105c. (note 9) under the high temperature environment, consider the power dissipation of ic when selecting the output current. when the terminal short circuits are continuously output, the output curr ent is reduced to climb to the temperature inside ic. downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 5/ 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet electrical characteristics C continued bd7562xxx, bd7562sxxx (unless otherwise specified vdd=+ 12 v, vss=0v, t a =25c) parameter symbol temperature r ange limit unit conditions min typ max input offset voltage (note 10 ,1 1) v io 25 c - 1 9 mv vdd=5 to 14.5v full range - - 10 input offset current (note 10) i io 25 c - 1 - pa - input bias current (note 10) i b 25 c - 1 - pa - supply current (note 11) i dd 25 c - 750 1300 a r l = , all op-amps a v =0db, vdd=5v, in+=2.5v full range - - 1500 25 c - 900 1400 r l = , all op-amps a v =0db, vdd=12v, in+=6.0v full range - - 1600 maximum output voltage (high) v oh 25 c vdd-0.1 - - v r l =10k maximum output voltage (low) v ol 25 c - - vss+0.1 v r l =10k large single voltage gain a v 25 c 70 95 - db r l =10k input common-mode voltage range v icm 25 c 0 - 12 v vss to vdd common-mode rejection ratio cmrr 25 c 45 60 - db - power supply rejection ratio psrr 25 c 60 80 - db - output source current (note 12) i source 25 c 3 8 - ma out=vdd-0.4v output sink current (note 12) i sink 25 c 4 14 - ma out=vss+0.4v slew rate sr 25 c - 0.9 - v/s c l =25pf gain bandwidth gbw 25 c - 1.0 - mhz c l =25pf, a v =40db phase margin 25 c - 50 - deg c l =25pf, a v =40db total harmonic distortion + noise thd +n 25 c - 0.05 - % out=1v p-p ,f=1khz channel separation cs 25 c - 100 - db a v =40db, out=1vrms (note 10 ) absolute value. (note 11) full range bd7562xxx t a =- 40 c to +85c bd7562sxxx t a =- 40 c to +105c. (note 12) under the high temperature environment, consider the powe r dissipation of ic when selecting the output current. when the terminal short circuits are continuously output, the output curr ent is reduced to climb to the temperature inside ic. downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 6/ 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet description of electrical characteristics described below are descriptions of the relevant electrical t erms used in this datasheet. items and symbols used are also shown. note that item name and symbol and their meaning may diffe r from those on another manufacturers document or general document. 1. absolute maximum ratings absolute maximum rating items indicate the condition w hich must not be exceeded. application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) supply voltage (vdd/vss) indicates the maximum voltage that can be applied betw een the vdd terminal and vss terminal without deterioration or destruction of characteristics of internal circuit. (2) differential input voltage (v id ) indicates the maximum voltage that can be applied between non-inverting and inverting terminals without damaging the ic. (3) input common-mode voltage range (v icm ) indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deteriorati on or destruction of electrical characteristics. input common-mode voltage range of the maximum ratings do es not assure normal operation of ic. for normal operation, use t he ic within the input common-mode voltage range ch aracteristics. (4) power dissipation (p d ) indicates the power that can be consumed by the ic when mounted on a specific board at the ambient tem perature 25c (normal temperature). as for package product, pd is de termined by the temperature that can be permitted by the ic in the package (maximum junction temperature) and the thermal resis tance of the package. 2. electrical characteristics (1) input offset voltage (v io ) indicates the voltage difference between non-inverting termi nal and inverting terminals. it can be translated into the input voltage difference required for setting the output volt age at 0 v. (2) input offset current (i io ) indicates the difference of input bias current between the non-inv erting and inverting terminals. (3) input bias current (i b ) indicates the current that flows into or out of the input termi nal. it is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) supply current (i dd ) indicates the current that flows within the ic under specified no-loa d conditions. (5) maximum output voltage(high) / maximum output voltage(low) (v oh /v ol ) indicates the voltage range of the output under specified load condition. it is typically divided into maximum ou tput voltage h igh and low. maximum output voltage high indicates the uppe r limit of output voltage. maximum output voltage low indicates the lower limit. (6) large signal voltage gain (a v ) indicates the amplifying rate (gain) of output voltage agai nst the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) w ith reference to dc voltage. a v = (output voltage) / (differential input voltage ) (7) input common-mode voltage range (v icm ) indicates the input voltage range where ic normally operates. (8) common-mode r eje ction ratio (cmrr) indicates the ratio of fluctuation of input offset voltage w hen the input common mode voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctua tion) (9) power supply r ej ection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr = (change of power supply voltage)/(input offset fluctuation) (10) output source current/ output s ink current (i source / i sink ) the maximum current that can be output from the ic under speci fic output conditions. the output source current indicates the current flowing out from the ic, and the output sink curre nt indicates the current flowing into the ic. (11) slew rate (sr) indicates the ratio of the change in output voltage with time when a step input signal is applied. (1 2) gain bandwidth (gbw) the product of the open-loop voltage gain and the frequency at which the voltage gain decreases 6db/octave. (13) phase margin () indicates the margin of phase from 180 degree phase lag at uni ty gain frequency. downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 7/ 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet (1 4) total harmonic distortion + noise (thd+n) indicates the fluctuation of input offset voltage or that of outpu t voltage with reference to the change of output voltage of driven channel. ( 15 ) channel separation (cs) indicates the fluctuation in the output voltage of the drive n channel with reference to the change of output voltage of the channel which is not driven. downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 8/ 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet typical performance curves bd7561g, bd7561sg (*) the above characteristics are measurements of typica l sample, they are not guaranteed. bd7561g: - 40 c to +85c bd7561sg: - 40 c to +105c 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] figure 4. supply current vs supply voltage figure 5. supply current vs ambient temperature figure 2. power dissipation vs ambient temperature (derating curve) figure 3. power dissipation vs ambient temperature (derating curve) 0 200 400 600 800 4 8 12 16 supply voltage [v] supply current [a] - 40 c 25 c 85 c 105 c 0 200 400 600 800 -50 -25 0 25 50 75 100 125 ambient temperature [c] supply current [a] 5v 14 .5v 12 v 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] bd7561g 85 bd7561 sg 105 downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 9/ 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet typical performance curves - continued bd7561g, bd7561sg (*) the above characteristics are measurements of typica l sample, they are not guaranteed. bd7561g: - 40 c to +85c bd7561sg: - 40 c to +105c figure 6. maximum output voltage (high) vs supply voltage (r l =10k) figure 7. maximum output voltage (high) vs ambient temperature (r l =10k) figure 8. maximum output voltage (low) vs supply voltage (r l =10k) figure 9. maximum output voltage (low) vs ambient temperature (r l =10k) 4 8 12 16 4 8 12 16 supply voltage [v] maximum output voltage (high) [v] - 40 c 25 c 85 c 105 c 10 4 8 12 16 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (high) [v] 5v 14 .5v 12v 0 10 20 30 40 4 8 12 16 supply voltage [v] maximum output voltage (low) [mv] 0 10 20 30 40 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (low) [mv] - 40 c 25 c 85 c 105 c 5v 14 .5v 12v downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 10 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet typical performance curves - continued bd7561g, bd7561sg (*) the above characteristics are measurements of typica l sample, they are not guaranteed. bd7561g: - 40 c to +85c bd7561sg: - 40 c to +105c figure 10 . output source current vs output voltage (vdd=12v) figure 11 . output source current vs ambient temperature (out=vdd-0.4v) figure 12 . output sink current vs output voltage (vdd=3v) figure 13 . output sink current vs ambient temperature (out=vss+0.4v) 0 20 40 60 80 8 9 10 11 12 13 output voltage [v] output source current [ma] 0 20 40 60 80 100 -1.0 0.0 1.0 2.0 3.0 output voltage [v] output sink current [ma] - 40 c 25 c 85 c 105 c 0 3 6 9 12 15 -50 -25 0 25 50 75 100 125 ambient temperature [c] output source current [ma] 0 10 20 30 40 -50 -25 0 25 50 75 100 125 ambient temperature [c] output sink current [ma] 5v 14.5v 12 v 14 .5v 5v 12v - 40 c 25 c 85 c 105 c downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 11 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet typical performance curves - continued bd7561g, bd7561sg (*) the above characteristics are measurements of typica l sample, they are not guaranteed. bd7561g: - 40 c to +85c bd7561sg: - 40 c to +105c figure 16 . input offset voltage vs input voltage (vdd=12v) -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 4 8 12 16 supply voltage [v] input offset voltage [mv] -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] input offset voltage [mv] figure 1 4. input offset voltage vs supply voltage (v icm =vdd/2, e k =-vdd/2) figure 1 5. input offset voltage vs ambient temperature (v icm =vdd/2, e k =- vd d/2) - 40 c 25 c 85 c 105 c 14 .5v 5v 12v figure 1 7. la rge signal voltage gain vs supply voltage 60 80 100 120 140 160 4 8 12 16 supply voltage [v] large signal voltage gain [db] - 40 c 25 c 85 c 105 c -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -1 0 1 2 3 4 5 6 7 8 9 10 11 12 13 input voltage [v] input offset voltage [mv] -40c 25c 85c 105c downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 12 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet typical performance curves - continued bd7561g, bd7561sg (*) the above characteristics are measurements of typica l sample, they are not guaranteed. bd7561g: - 40 c to +85c bd7561sg: - 40 c to +105c 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 ambient temperature [c] power supply rejection ratio [db] figure 1 8. large signal voltage gain vs ambient temperature figure 1 9. common mode rejection ratio vs supply voltage (vdd=12v) figure 20. common mode rejection ratio vs ambient temperature (vdd=12v) figure 21. power supply rejection ratio vs ambient temperature 60 80 100 120 140 160 -50 -25 0 25 50 75 100 125 ambient temperature [c] large signal voltage gain [db] 0 20 40 60 80 100 120 4 8 12 16 supply voltage [v] common mode rejection ratio [db] 5v 12v 14.5v - 40 c 25 c 85 c 105 c 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 ambient temperature [c] common mode rejection ratio [db] 14 .5v 12v 5v downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 13 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet typical performance curves - continued bd7561g, bd7561sg (*) the above characteristics are measurements of typica l sample, they are not guaranteed. bd7561g: - 40 c to +85c bd7561sg: - 40 c to +105c 0.0 1.0 2.0 3.0 4.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate l-h [v/s] 0.0 0.5 1.0 1.5 2.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate h-l [v/s] figure 22. slew rate l-h vs ambient temperature figure 23. slew rate h-l vs ambient temperature figure 24. voltage ga in ? phase vs frequency 14 .5v 12v 5v 14 .5v 12v 5v 0 20 40 60 80 100 frequency [hz] voltage gain [db] 0 40 80 120 160 200 phase [deg] phase gain 10 10 2 10 3 10 4 10 5 10 6 10 7 downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 14 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet typical performance curves - continued bd7562xxx, bd7562sxxx (*) the above characteristics are measurements of typica l sample, they are not guaranteed. bd7562 xxx : - 40 c to +85c bd7562s xxx : - 40 c to +105c 0 200 400 600 800 1000 1200 -50 -25 0 25 50 75 100 125 ambient temperature [c] supply current [a] 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] figure 27. supply current vs supply voltage figure 28. supply current vs ambient temperature figure 25. power dissipation vs ambient temperature (derating curve) figure 26 . power dissipation vs ambient temperature (derating curve) 0 200 400 600 800 1000 1200 4 8 12 16 supply voltage [v] supply current [a] - 40 c 25 c 85 c 105 c 5v 14 .5v 12 v 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] bd7562f 85 bd7562sf 105 bd7562fvm bd7562sfvm downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 15 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet typical performance curves - continued bd7562xxx, bd7562sxxx (*) the above characteristics are measurements of typica l sample, they are not guaranteed. bd7562 xxx : - 40 c to +85c bd7562s xxx : - 40 c to +105c figure 29. maximum output voltage (high) vs supply voltage (r l =10k) figure 30. maximum output voltage (high) vs ambient temperature (r l =10k) figure 31. maximum output voltage (low) vs supply voltage (r l =10k) figure 32. maximum output voltage (low) vs ambient temperature (r l =10k) 4 8 12 16 4 8 12 16 supply voltage [v] maximum output voltage (high) [v] - 40 c 25 c 85 c 105 c 10 4 8 12 16 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (high) [v] 5v 14 .5v 12v 0 10 20 30 40 4 8 12 16 supply voltage [v] maximum output voltage (low) [mv] 0 10 20 30 40 -50 -25 0 25 50 75 100 125 ambient temperature [c] maximum output voltage (low) [mv] - 40 c 25 c 85 c 105 c 5v 14 .5v 12v downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 16 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet typical performance curves - continued bd7562xxx, bd7562sxxx (*) the above characteristics are measurements of typica l sample, they are not guaranteed. bd7562 xxx : - 40 c to +85c bd7562s xxx : - 40 c to +105c figure 33. output source current vs output voltage (vdd=12v) figure 34. output source current vs ambient temperature (out=vdd-0.4v) figure 35. output sink current vs output voltage (vdd=3v) figure 36. output sink current vs ambient temperature (out=vss+0.4v) 0 20 40 60 80 8 9 10 11 12 13 output voltage [v] output source current [ma] 0 20 40 60 80 100 -1.0 0.0 1.0 2.0 3.0 output voltage [v] output sink current [ma] 0 3 6 9 12 15 -50 -25 0 25 50 75 100 125 ambient temperature [c] output source current [ma] 0 10 20 30 40 -50 -25 0 25 50 75 100 125 ambient temperature [c] output sink current [ma] 5v 14.5v 12 v 14 .5v 5v 12v - 40 c 25 c 85 c 105 c - 40 c 25 c 85 c 105 c downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 17 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet typical performance curves - continued bd7562xxx, bd7562sxxx (*) the above ch aracteristics are measurements of typical sample, they ar e not guaranteed. bd7562 xxx : - 40 c to +85c bd7562s xxx : - 40 c to +105c figure 39. input offset voltage vs input voltage (vdd=12v) -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 4 8 12 16 supply voltage [v] input offset voltage [mv] -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] input offset voltage [mv] figure 37 . input offset voltage vs supply voltage (v icm =vdd/2, e k =- vd d/2) figure 38 . input offset voltage vs ambient temperature (v icm =vdd/2, e k =- vd d/2) - 40 c 25 c 85 c 105 c 14 .5v 5v 12v figure 40 . large signal voltage gain vs supply voltage -10.0 -7.5 -5.0 -2.5 0.0 2.5 5.0 7.5 10.0 -1 0 1 2 3 4 5 6 7 8 9 10 11 12 13 input voltage [v] input offset voltage [mv] -40c 25c 85c 105c 60 80 100 120 140 160 4 8 12 16 supply voltage [v] large signal voltage gain [db] - 40 c 25 c 85 c 105 c downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 18 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet typical performance curves - continued bd7562xxx, bd7562s xxx (*) the above characteristics are measurements of typica l sample, they are not guaranteed. bd7562 xxx : - 40 c to +85c bd7562s xxx : - 40 c to +105c 0 40 80 120 160 200 -50 -25 0 25 50 75 100 125 ambient temperature [c] power supply rejection ratio [db] figure 41 . large signal voltage gain vs ambient temperature figure 42 . common mode rejection ratio vs supply voltage (vdd=12v) figure 43 . common mode rejection ratio vs ambient temperature (vdd=12v) figure 44 . power supply rejection ratio vs ambient temperature 60 80 100 120 140 160 -50 -25 0 25 50 75 100 125 ambient temperature [c] large signal voltage gain [db] 0 20 40 60 80 100 120 4 8 12 16 supply voltage [v] common mode rejection ratio [db] 5v 12v 14.5v - 40 c 25 c 85 c 105 c 0 20 40 60 80 100 120 -50 -25 0 25 50 75 100 125 ambient temperature [c] common mode rejection ratio [db] 14 .5v 12v 5v downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 19 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet typical performance curves - continued bd7562xxx, bd7562s xxx (*) the above characteristics are measurements of typica l sample, they are not guaranteed. bd7562 xxx : - 40 c to +85c bd7562s xxx : - 40 c to +105c 0.0 1.0 2.0 3.0 4.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate l-h [v/s] 0.0 0.5 1.0 1.5 2.0 -50 -25 0 25 50 75 100 125 ambient temperature [c] slew rate h-l [v/s] figure 45 . slew rate l-h vs ambient temperature figure 46 . slew rate h-l vs ambient temperature figure 47 . voltage gain ? phase vs frequency 14 .5v 12v 5v 14 .5v 12v 5v 0 20 40 60 80 100 frequency [hz] voltage gain [db] 0 40 80 120 160 200 phase [deg] phase gain 10 10 2 10 3 10 4 10 5 10 6 10 7 downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 20 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet application information null method condition for test circuit 1 vcc, vee, e k , v icm unit: v parameter v f sw1 sw2 sw3 vdd vss e k v icm calculation input offset voltage v f1 on on off 12 0 -6 12 1 large signal voltage gain v f2 on on on 12 0 -0.5 6 2 v f3 -11.5 common-mode rejection ratio (input common-mode voltage range) v f4 on on off 12 0 -6 0 3 v f5 12 power supply rejection ratio v f6 on on off 5 0 -2.5 0 4 v f7 14.5 - calculation - 1. input offset voltage (v io ) 2. large signal voltage gain (a v ) 3. common-mode rejection ration (cmrr) 4. power supply rejection ratio (psrr) |v f5 - v f4 | cmrr = 20log ? v icm (1+r f /r s ) [db] av = 20log |v f3 - v f2 | ? e k (1+r f /r s ) [db] psrr = 20log |v f7 - v f6 | ? v cc (1+ r f /r s ) [db] v io = 1 + r f /r s [v] |v f1 | figure 48 . test circuit 1 (one channel only) v icm r s =50 r s =50 r f =5 0k r i = 1m r i = 1m 0.015f 0.015f sw1 sw2 50k sw3 r l v rl 0.1f e k 500k 500k 1000pf v f 0. 0 1f 15v - 15v vdd vss vo v null dut downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 21 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet switch condition for test circuit 2 sw no. sw1 sw2 sw3 sw4 sw5 sw6 sw7 sw8 sw9 sw10 sw11 sw12 supply current off off on off on off off off off off off o ff maximum output voltage (r l =10k ) off on off off on off off on off off on off output current off on off off on off off off off on off off slew rate off off on off off off on off on off off on gain bandwidth on off off on on off off o ff on off off on figure 50 . slew rate input and output wave figure 51 . test circuit 3 (channel separation) figure 49 . test circuit 2 (each channel) sw 3 sw1 sw2 sw9 sw10 sw11 sw8 sw5 sw6 sw7 c l sw12 sw4 r1 =1k r2=100k r l vss vdd out in - in+ vh vl t input wave vh vl t v sr = v/t t output wave 90% 1 0% input wave output wave r2=100k r1=1k v dd vss out1 v in r1//r2 out2 r2=100k r1=1k v dd vss r1//r2 downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 22 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet power dissipation power dissipation (total loss) indicates the power that th e ic can consume at t a =25c (normal temperature). as the ic consumes power, it heats up, causing its temperature to be higher than the ambient temperature. the allowable temperature that the ic can accept is limited. this depen ds on the circuit configuration, manufacturing process, and consumable power. power dissipation is determined by the allowable tempera ture within the ic (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). maximum junction temperature is typically equ al to the maximum storage temperature. the heat generated through the c onsumption of power by the ic radiates from the mold resin or lead frame of the package. thermal resistance, repres ented by the symbol ja c/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 52 (a) shows the model of the thermal resistance of a package. the equation below shows how to compute for the thermal resistance ( ja ), given the ambient temperature (t a ), maximum junction temperature (t jmax ), and power dissipation (p d ). ja = (t jmax t a ) / p d c/w the derating curve in figure 52 (b) indicates the power that the ic can consume with reference to ambient temperature. power consumption of the ic begins to attenuate at certain tem peratures. this gradient is determined by thermal resistance ( ja ), which depends on the chip size, power consumption, pa ckage, ambient temperature, package condition, wind velocity, etc. this may also vary even when the sam e of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 52(c) to (f) shows an example of the derating curve for bd7561g, bd7561sg, bd7562xxx, and bd7562sxxx. 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] bd7561g (note 13) bd7561sg (note 13) (c) bd7561g (d) bd7561sg 85 105 ambient temperature t a [ c ] chip surface temperature t j [ c ] (a) thermal resistance ja =( t jmax -t a )/ p d c /w 0 ambient temperature t a [ ? c] p2 p1 25 125 75 100 50 power dissipation of lsi [w] p dmax t jmax ja2 ja1 ja 2 < ja 1 power dissipation of ic (b) derating curve figure 52 . thermal resistance and derating curve downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 23 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet power dissipation - continued when using the unit above t a =25 , subtract the value above per celsius degree . power dissipation is the value when fr4 glass epoxy board 70mm 70mm 1.6mm (copper foil area less than 3%) is mounted. (note 13) (note 14) (note 15) unit 5.4 5.5 4 .7 mw/c figure 52 . thermal resistance and derating curve 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] 0.0 0.2 0.4 0.6 0.8 0 25 50 75 100 125 ambient temperature [c] power dissipation [w] bd7562 f (note 14) (e) bd7562xxx (f) bd7561s xxx 85 105 bd7562fvm (note 15) bd7562sfvm (note 15) bd7562sf (note 14) downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 24 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting th e analog block. furthermore, connect a capacitor to ground at all power su pply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground trac es, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute ma ximum rating of the p d stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent excee ding the p d rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequenc e and delays, especially if the ic has more than one pow er supply. therefore, give special consideration to power coup ling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground t he ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounti ng the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal parti cles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during as sembly to name a few. 11. unused input pins input pin s of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input pin s should be connected to the power supply or ground line. downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 25 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet operational notes C continued 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably form ed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interfe rence among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic e lements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. furthe rmore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even if the power su pply voltage is applied, make sure that the input p in s have voltages within the values specified in the electrical chara cteristics of this ic. 13. unused circuits when there are unused op-amps, it is recommended that they a re connected as in figur e 53, setting the non-inverting input terminal to a potential within the in-phase input voltage range (v icm ). 14. input voltage applying v dd +0.3v to the input terminal is possible without causin g deterioration of the electrical characteristics or destruction , regardless of the supply voltage. however, this does not ensure normal circ uit operation. please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 15. power supply(single/dual) the operational amplifiers operate when the voltage supp lied is between vdd and vss. therefore, the single supply operational amplifiers can be used as dual supply operationa l amplifiers as well. 16. output capacitor if a large capacitor is connected between the output p in and v ss pin, current from the charged capacitor will flow into the output pin and may destroy the ic when the v dd pin is shorted to ground or pulled down to 0v. use a capacitor smaller than 0. 1 f between output pin and v ss pin . 17. oscillation by output capacitor please pay attention to the oscillation by output capaci tor and in designing an application of negative feedback loop circuit with these ics. 18. latch up be careful of input voltage that exceed the vdd and vss. when cmo s device have sometimes occur latch up and protect the ic from abnormaly noise. figure 53. example of application circuit for unused op-amp keep this potential in v icm vdd vss v icm - + downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 26 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet physical dimension, tape and reel information package name ssop5 downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 27 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet physical dimension tape and reel information C continued package name sop8 (unit : mm) pkg : sop8 drawing no. : ex112-5001-1 (max 5.35 (include.burr)) downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 28 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet physical dimension tape and reel information C continued pa ckage name msop8 downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 29 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet marking diagram product name package type marking bd7561 g ssop5 as bd7561s a8 bd7562 f sop8 7562 fvm msop8 bd7562s f sop8 7562s fvm msop8 sop8(top view) part number marking lot number 1pin mark msop8(top view) part number marking lot number 1pin mark part number marking ssop5(top view) lot number downloaded from: http:///
www.rohm.com tsz02201-0rar1g200250-1-2 ? 201 3 rohm co., ltd. all rights reserved. 30 / 30 20.feb.2015 rev.002 tsz22111 ? 15 ? 001 bd7561g bd7561sg bd7562xxx bd7562sxxx datasheet land pattern data all dimensions in mm package land pitch e land space mie land length R? 2 land width b2 ssop5 0.95 2.4 1.0 0.6 sop8 1.27 4.60 1.10 0.76 msop8 0.65 2.62 0.99 0.35 revision history date revision changes 20 .sep.2013 001 new release 20 .feb.2015 002 correction of figure number (page.22 power dissipation) sop8, msop8 mie ? 2 b2 e ssop5 ? e e ? 2 b2 mie downloaded from: http:///
datasheet d a t a s h e e t notice-ge rev.004 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-ge rev.004 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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